ATI Technologies FireGL X3-256 Guía de usuario Pagina 147
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L1 Controller Error Messages
007-4701-003 125
Table 5-2 L1 Controller Messages
L1 System Controller Message Message Meaning and Action Needed
Internal voltage messages:
ATTN: x.xV high fault limit reached @ x.xxV 30-second power-off sequence for the module.
ATTN: x.xV low fault limit reached @ x.xxV 30-second power-off sequence for the module.
ATTN: x.xV high warning limit reached @
x.xxV
A higher than nominal voltage condition is
detected.
ATTN: x.xV low warning limit reached @ x.xxV A lower than nominal voltage condition is
detected.
ATTN: x.xV level stabilized @ x.xV A monitored voltage level has returned to
within acceptable limits.
Fan messages:
ATTN: FAN # x fault limit reached @ xx RPM A fan has reached its maximum RPM level. The
ambient temperature may be too high. Check to
see if a fan has failed.
ATTN: FAN # x warning limit reached @ xx
RPM
A fan has increased its RPM level. Check the
ambient temperature. Check to see if the fan
stabilizes.
ATTN: FAN # x stabilized @ xx RPM An increased fan RPM level has returned to
normal.
Temperature messages: low alt.
ATTN: TEMP # advisory temperature reached
@ xxC xxF
The ambient temperature at the module’s air
inlet has exceeded 30 ºC.
ATTN: TEMP # critical temperature reached
@ xxC xxF
The ambient temperature at the module’s air
inlet has exceeded 35 ºC.
ATTN: TEMP # fault temperature reached
@ xxC xxF
The ambient temperature at the module’s air
inlet has exceeded 40 ºC.
Temperature messages: high alt.
ATTN: TEMP # advisory temperature reached
@ xxC xxF
The ambient temperature at the module’s air
inlet has exceeded 27 ºC.
- Silicon Graphics Prism 1
- Visualization System 1
- Configurations 1
- Record of Revision 3
- 007-4701-003 vii 7
- 007-4701-003 ix 9
- Contents 10
- About This Guide 17
- Important Information 18
- Chapter Descriptions 19
- Related Publications 20
- Conventions 21
- Product Support 21
- Reader Comments 22
- 007-4701-003 1 23
- XG2N and Compute Modules 24
- 007-4701-003 3 25
- Module Pipe Numbering) 25
- 4 007-4701-003 26
- Pipe Numbering) 26
- Front Panel Controls 27
- 6 007-4701-003 28
- 007-4701-003 7 29
- Internal Components 30
- Safety Precautions 31
- ESD Precautions 32
- Safety Measures 33
- Quick Start Information 34
- 007-4701-003 13 35
- Components within rack 36
- 16 007-4701-003 38
- Connecting a Monitor 40
- Keyboard 41
- USB type A 41
- Base compute module 41
- 20 007-4701-003 42
- 007-4701-003 21 43
- Power-On the System 44
- Verifying System Connections 45
- 24 007-4701-003 46
- Powering Off Manually 47
- 007-4701-003 27 49
- Physical Features 50
- 17U rack 51
- 39U rack 51
- Functional Architecture 52
- 007-4701-003 31 53
- 32 007-4701-003 54
- System Components 55
- 34 007-4701-003 56
- XG2N Graphics Module 57
- CPU Expansion Module 58
- Front view 59
- Rear view 59
- 007-4701-003 39 61
- Router Module 62
- (as shown in Figure 2-7): 64
- ELEC RATING 65
- 100-240VAC 65
- 1.0-0.6A 65
- FUSE 250V-6.3A 65
- Storage Expansion 66
- 46 007-4701-003 68
- 007-4701-003 47 69
- Power Components 70
- 007-4701-003 49 71
- 50 007-4701-003 72
- Figure 2-13 Shelf Rails 72
- Optional Devices 74
- Optional IO9 PCI Card 75
- Optional Tape Devices 75
- Optional DM8 Audio Board 76
- Cables and Connectors 77
- Functional Features 77
- Troubleshooting Tips 78
- Optional USB Extender 79
- 3. Configurations and Cabling 81
- System Configurations 82
- 007-4701-003 65 87
- Minimum Routed Configuration 88
- 007-4701-003 67 89
- Maximum Routed Configuration 90
- 007-4701-003 69 91
- 70 007-4701-003 92
- 3: Configurations and Cabling 92
- 007-4701-003 71 93
- Safety Instructions 94
- 007-4701-003 73 95
- Opening the Cover 96
- 007-4701-003 75 97
- 76 007-4701-003 98
- 007-4701-003 77 99
- 78 007-4701-003 100
- 007-4701-003 79 101
- Closing the Cover 102
- PCI and PCI-X Cards 103
- 82 007-4701-003 104
- 007-4701-003 83 105
- 84 007-4701-003 106
- 007-4701-003 85 107
- 86 007-4701-003 108
- Removing a PCI or PCI-X Card 109
- 88 007-4701-003 110
- 007-4701-003 89 111
- 90 007-4701-003 112
- 007-4701-003 91 113
- 92 007-4701-003 114
- 007-4701-003 93 115
- 94 007-4701-003 116
- 007-4701-003 95 117
- 96 007-4701-003 118
- 007-4701-003 97 119
- Disk Drives 120
- Installing a Disk Drive 121
- 100 007-4701-003 122
- Removing a Disk Drive 123
- 102 007-4701-003 124
- 007-4701-003 103 125
- 104 007-4701-003 126
- 007-4701-003 105 127
- 106 007-4701-003 128
- 007-4701-003 107 129
- 108 007-4701-003 130
- Installing a DIMM Group 131
- 110 007-4701-003 132
- 007-4701-003 111 133
- Figure 4-25 Inserting a DIMM 133
- Removing a DIMM 134
- 007-4701-003 113 135
- Figure 4-26 Removing a DIMM 135
- L1 Controller Display 136
- 007-4701-003 115 137
- 116 007-4701-003 138
- 007-4701-003 117 139
- 118 007-4701-003 140
- System” on page 22 141
- 5. Troubleshooting 143
- Troubleshooting Chart 144
- L1 Controller Error Messages 146
- SGI Electronic Support 152
- 007-4701-003 131 153
- 132 007-4701-003 154
- 5: Troubleshooting 154
- 007-4701-003 133 155
- Sample Stereo Mode Entries 157
- 5. Save the gdm.conf file: 159
- 6. Restart graphics: 159
- 6. Save the gdm.conf file: 161
- 7. Restart graphics: 161
- Enabling Overlay Planes 162
- 007-4701-003 141 163
- Configuring Monitor Positions 165
- SG-0 SG-1 166
- SG-2 SG-3 166
- Configuring Monitor Types 167
- 146 007-4701-003 168
- Identifying Event Devices 169
- 148 007-4701-003 170
- A. Technical Specifications 177
- Environmental Specifications 178
- Compute Module Specifications 179
- Characteristic Specification 180
- CMPX Module Specifications 181
- Router Module Specifications 182
- Rack Specifications 183
- 007-4701-003 163 185
- Compute Module 186
- 007-4701-003 165 187
- XG2N Module Connectors 188
- Pin Function Pin Function 189
- CMPX Module 190
- SGI TP900 Storage Module 191
- DB-9 Serial Connector 192
- RJ-45 Connector 194
- Pin Assignment Pin Assignment 195
- USB Type A Connector 197
- USB Type B Connector 198
- 007-4701-003 177 199
- 178 007-4701-003 200
- 007-4701-003 179 201
- Slide Rail Mounting Hardware 203
- 182 007-4701-003 204
- 007-4701-003 183 205
- 184 007-4701-003 206
- Preparing the Module 207
- 186 007-4701-003 208
- 007-4701-003 187 209
- 188 007-4701-003 210
- 007-4701-003 189 211
- 190 007-4701-003 212
- 007-4701-003 191 213
- 007-4701-003 193 215
- 194 007-4701-003 216
- 007-4701-003 195 217
- Figure B-11 218
- C. Installing Rack Systems 219
- Pre-Installation Activities 220
- Power Receptacle Verification 221
- 200 007-4701-003 222
- C: Installing Rack Systems 222
- 007-4701-003 201 223
- 202 007-4701-003 224
- 007-4701-003 203 225
- 204 007-4701-003 226
- Inspecting the Shipping Crate 227
- 206 007-4701-003 228
- 007-4701-003 207 229
- 208 007-4701-003 230
- 007-4701-003 209 231
- 210 007-4701-003 232
- 007-4701-003 211 233
- Figure C-7 Leveling Bolts 233
- O) position. Then 233
- 212 007-4701-003 234
- 007-4701-003 213 235
- Figure C-9 Leveling Bolts 235
- O) position 235
- 214 007-4701-003 236
- 007-4701-003 215 237
- Figure C-10 Joining Locations 237
- System Model Number 239
- Electromagnetic Emissions 240
- VCCI Notice (Japan Only) 241
- Shielded Cables 242
- Electrostatic Discharge 242
- Laser Compliance Statements 243
- Lithium Battery Statement 244
- 224 007-4701-003 246
- 226 007-4701-003 248
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